DN Solutions introduces DNC Series for precision grinding in semiconductor manufacturing

DN Solutions has introduced the DNC Series, comprising the DNC 8050 and DNC 8060, a new generation of high-precision grinding machines developed specifically for semiconductor manufacturing. These machines are designed to handle some of the industry’s toughest materials, including quartz, ceramic, and silicon carbide (SiC), which are used in consumable components such as focus rings for wafer processing equipment. By combining precision, stability, and automation, the DNC Series enables reliable machining of materials that are essential for advanced semiconductor production environments.

The name DNC stands for DN Solutions Ceramic, reflecting the company’s equipment designed for ceramic machining. In semiconductor manufacturing, consumable components like focus rings operate inside process chambers exposed to high temperatures and harsh chemicals. These parts must therefore be made from extremely durable materials such as quartz, ceramic, and silicon carbide (SiC), which are very difficult to machine with conventional tools.

Quartz, in particular, poses significant machining challenges. Although it is harder than carbon steel, it is brittle and prone to cracking. Even with expensive diamond tools, micro-cracks and breakage can easily occur. In addition, quartz is highly sensitive to impurities, requiring an exceptionally clean machining environment to prevent contamination during processing. To meet these demands, DN Solutions developed a high-performance grinding spindle for the DNC Series. With a rotational speed of 10,000 rpm and an output of 7.5 kW, the spindle provides both high productivity and accuracy, even when machining materials that are normally difficult to cut.

Long-term accuracy through vibration and heat control

In conventional grinding systems, prolonged operation often leads to spindle drift, vibration, and heat-induced deformation, which can compromise precision. The DNC Series addresses these issues through a monolithic, high-rigidity bed structure combined with high-precision feed-axis guides. These features effectively suppress vibration and minimize thermal displacement, maintaining structural rigidity and machining accuracy even during long, continuous operations. As a result, the DNC Series not only enhances long-term accuracy but also extends machine and tool life, offering users improved reliability and lower maintenance costs. The combination of structural stability and advanced spindle technology allows DN Solutions to achieve both high throughput and repeatable precision in semiconductor component manufacturing.

Clean solutions for quartz dust and tool dressing challenges

During grinding, fine quartz dust or sludge is generated, which can cause severe equipment damage if not properly managed. To prevent this, DN Solutions equipped the DNC Series with a fully enclosed sliding cover that protects the inclined bed surface from coolant and dust contamination. Additionally, the straight, detachable coolant tank simplifies cleaning and maintenance, allowing quick removal of sludge buildup.

The DNC Series also integrates an internal spindle for automatic tool dressing. During grinding operations, the wheel surface gradually becomes clogged with debris, reducing cutting performance. Traditional machines require production to stop for manual dressing. In contrast, the DNC Series performs this task automatically and seamlessly, maintaining consistent grinding performance without interrupting production.

Multi-functionality and automation for high productivity

Beyond its grinding capabilities, the DNC Series combines the functionalities of both a machining center and a turning center. This integration enables complex operations such as inner and outer diameter machining, hole processing, and contour shaping to be performed in a single setup. For additional efficiency, the DNC Series is equipped with an Automatic Tool Changer (ATC), an Automatic Tool Measuring Device, and an Automatic Workpiece Measuring Device. These systems enable fully automated operation, reduce operator workload, and ensure stable, high-precision production even under continuous operation.

Market position and strategic significance

According to DN Solutions, the company already holds around 50% of the South Korean semiconductor material machining equipment market, and nearly 80% in certain process segments. Building on this strong foundation, the DNC Series reflects DN Solutions’ accumulated expertise and experience in semiconductor machining technology.

The new models are expected to play a key role in strengthening customers’ manufacturing competitiveness and technological capabilities, both domestically and worldwide.