Semiconductor Manufacturers Save Costs with TRUMPF 3D-printers

TRUMPF's additive manufacturing (AM) technology improves precision and reduces waste in semiconductor manufacturing. By enhancing machine functionality, AM technology supports more efficient production and minimizes costly defects, crucial in an industry requiring nanometer-level accuracy.

The additive manufacturing (AM) technology of TRUMPF makes semiconductor manufacturing systems more precise and efficient. “Semiconductor manufacturers can reduce scrap and cut costs with AM technology. The innovative approach of using additive manufactured parts enhances the functionality and precision of semiconductor manufacturing machines and paves the way for more efficient production processes”, said Marco Andreetta, responsible for the semicon industry at TRUMPF. The chip industry requires machines that work with optimal precision and repeatability with performance specifications in the nanometer range. The smallest of deviations can lead to defective chips, i.e. expensive scrap.

Semicon industry reaps benefits from AM technology

The complex machines in the semiconductor industry depend on the precision of each individual component. Fluid and gas manifolds are examples of this fact. Because of their design, the traditional manufacture of complex fluid manifolds resulted in large, heavy parts that have abrupt fluid flow and stagnant zones and could be prone to leakage. The resulting pressure drops and flow-induced vibration have a negative influence on the semiconductor capital equipment. “With AM technology, suppliers of semicon capital equipment can avoid the traditional complex manufacturing assembly and consolidate several parts into one, improving yield and reliability”, said Andreetta. The optimization of the manifolds leads to more efficient and robust components, ultimately improving the overall performance of semiconductor manufacturing machines. AM technology of TRUMPF enables the production of components for semicon machines with enhanced stiffness and reduced weight, crucial for the high-performance demands of semiconductor manufacturing. AM-manufactured fluid manifolds have fewer pressure drops, mechanical disturbances and lower flow-induced vibration. The geometrical freedom of AM can help reduce possible leakage points and increase part performance and reliability.

Monitoring solution for 3D printing

The quality required for parts used in semiconductor manufacturing machines is unparalleled, and a challenge for any manufacturing technology. With its monitoring solution for 3D printing, TRUMPF makes it possible to fulfil these requirements with automatic multi-laser alignment (AMA) and melt pool monitoring. AMA offers TruPrint users fully automated online monitoring and correction of the positioning of the laser beam paths in relation to each other – accurate down to a few micrometers. The second release of the AMA system enables faster acquisition and finer correction. The patented system visually acquires the position of master and slave and corrects the second one. The procedure is performed between the production of individual layers, with an interval set by the user. TRUMPF technology also monitors the melt pool live during the printing process. “This not only ensures quality but also potentially reduces costs,” said Andreetta. That is possible because live monitoring of the melt pool during the manufacturing process could reduce expensive non-destructive tests (NDT) such as a computer tomography (CT) scan of the component after production.