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  • Fraunhofer IPMS develops new routes for chip integration and semiconductor technologies
    • Fraunhofer
    • Innovation
    • Semicon
    • november 10, 2026
    • Tim Wentink
    • 0 Comments

    Fraunhofer IPMS develops new routes for chip integration and semiconductor technologies

    Fraunhofer IPMS will present semiconductor manufacturing and integration technologies at SEMICON Europa 2026 in Munich. Its work examines how separately manufactured chip components…

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  • Fraunhofer IPMS advances sustainable chip production in Europe
    • Fraunhofer
    • Innovation
    • september 9, 2026
    • Tim Wentink
    • 0 Comments

    Fraunhofer IPMS advances sustainable chip production in Europe

    The GENESIS project brings more than 50 European partners together to reduce the environmental impact of semiconductor manufacturing. Fraunhofer IPMS coordinates research on waste and…

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  • Fraunhofer IWS develops thick ta-C coatings for improved wear protection
    • Fraunhofer
    • Innovation
    • september 3, 2026
    • Tim Wentink
    • 0 Comments

    Fraunhofer IWS develops thick ta-C coatings for improved wear protection

    Tetrahedral amorphous carbon coatings, known as ta-C, are used where low friction and wear resistance are required. Fraunhofer IWS has adapted its Laser-Arc process to produce coatings…

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Latests posts
  • Fraunhofer IPMS develops new routes for chip integration and semiconductor technologies
    Fraunhofer IPMS develops new routes for chip integration and semiconductor technologiesnovember 10, 2026
  • Fraunhofer IPMS advances sustainable chip production in Europe
    Fraunhofer IPMS advances sustainable chip production in Europeseptember 9, 2026
  • Fraunhofer IWS develops thick ta-C coatings for improved wear protection
    Fraunhofer IWS develops thick ta-C coatings for improved wear protectionseptember 3, 2026

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