TRUMPF develops laser cooling structures for AI chip stacks
TRUMPF is presenting an ultrashort pulse laser application at Semicon Taiwan. The process produces cooling structures…
Read moreTim Wentink
CLASCO project develops laser process chain for complex metal surfaces
The completed CLASCO research project developed an integrated laser-based route for post-processing additively…
Read moreUNITED MACHINING SOLUTIONS to present five new products at AMB 2026
UNITED MACHINING SOLUTIONS will unveil five new products at AMB 2026 in Stuttgart. Three premieres will come from…
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Heidelberg University develops recyclable ink for light-based 3D printing
A research team at Heidelberg University has developed a polymer material for light-based 3D printing that can…
Read more17 companies shortlisted for the AMB Award
Seventeen companies have been nominated for the AMB Award 2026. They were selected from around 50 submissions….
Read moreTeqram presents enhanced EasyGrinder at EuroBLECH 2026
Teqram will present an extended version of its EasyGrinder at EuroBLECH 2026 in Hanover. The AI-driven grinding…
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